The XwinSys product line is designed to offer an attractive and innovative technological solution for the rapidly growing Semiconductors market. The Company’s modular technological concept allows multiple application capabilities, cost-effective maintenance and a budget oriented approach.
The increasing complexity of materials and geometries in modern Semiconductor manufacturing is driving the need for advanced metrology techniques and methodologies. The industry is experiencing a shift of sophisticated off-line analytical metrology tools into the fab line, providing automatic in-site process control. Multi-sensor technology combined with holistic software appears to be the path of choice for metrology in the fab.
The XwinSys Integrated and improved X-Ray and optical (3D & 2D) analysis forms a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures, thin-films, multi-stack and organic applications of the semiconductor industry.
The merging of our two core technologies - XRF and automated 3D imaging - results in a hybrid solution that is truly synergistic in that the sum is greater than its parts.
The increasing complexity of materials and geometries in modern Semiconductor manufacturing is driving the need for advanced metrology techniques and methodologies. The industry is experiencing a shift of sophisticated off-line analytical metrology tools into the fab line, providing automatic in-site process control. Multi-sensor technology combined with holistic software appears to be the path of choice for metrology in the fab.
The XwinSys Integrated and improved X-Ray and optical (3D & 2D) analysis forms a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures, thin-films, multi-stack and organic applications of the semiconductor industry.
The merging of our two core technologies - XRF and automated 3D imaging - results in a hybrid solution that is truly synergistic in that the sum is greater than its parts.
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