Copper Pillar Bumps Layers Thickness

5 seconds Shot for full feature parameters, The Multi-Stack Application for bumps, Accurate and repeatable results

August 13th 2017

-5 seconds Shot for full feature parameters
-The Multi-Stack Application for bumps
-Accurate and repeatable results
-Calculating cross wafer variation
-Pillar bumps metrology
-The metrology solution - XwinSys Onyx
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