XwinSys Technology Development Ltd., has been granted a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump.
This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.
Bruce Rowlands, Chairman and CEO stated, "The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as bump height, pillar height and solder composition ensuring overall product quality “.
This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.
Bruce Rowlands, Chairman and CEO stated, "The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as bump height, pillar height and solder composition ensuring overall product quality “.
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