Press Release

XwinSys Recent Press Releases

    Press Release

    Rigaku Corporation and DYG Holdings LTD Announce Rigaku to Acquire XwinSys Technologies Development Ltd (XWS)

    July 15th 2019
    Press Release

    XwinSys Publishes a New Article in Solid State Magazine

    July 6th 2016
    Unique In-line and non-destructive hybrid technology – a new standard for the semiconductor industry
    Press Release

    XwinSys will be participating in SEMICON West 2016

    June 15th 2016
    Patented Hybrid In-Line Metrology System to be Featured
    Press Release

    XwinSys Receives United States Patent

    May 12th 2016
    United States Patent Office Grants Process Patent
    Press Release

    XwinSys Announces Novel Solution for the Semiconductor Industry

    February 23rd 2016
    NMT: Noise-reduced Multilayer Thin-film Measurement System a Revolutionary Tool
    Press Release

    XwinSys Receives $300,000 Grant

    December 1st 2014
    Significant Progress in Bumps Inspection System for Semiconductor Manufacturing
    Press Release

    XwinSys Subsidiary Advancements

    April 26th 2014
    Press Release

    XwinSys Receives $250,000 Grant

    November 29th 2013
    -Office of the Chief Scientist of Israel Supports Wafer Bumps Inspection and Measurement System-
    Press Release

    XwinSys Receives Development Grant

    November 29th 2012
    Press Release

    Eurocontrol Technics Group Finalizes Acquisition of XwinSys Ltd.

    May 7th 2012
    -Partnership Will Bring New Verification Technology to the Semiconductor Industry-