Site search:
+972-4-9891313
info@xwinsys.com
Privacy |
Terms |
Disclaimer
Home
Solutions
Film Stack
Ultra-Thin Films Measurement
Light Elements Detection
UBM / RDL: Thickness Monitoring
Bump Inspection - Composition & Height
Real Time Review - Detection & Metrology
Products & Technology
Onyx
Agate
Sapphire
XRF Analysis
3D Scanner
2D Microscope
Support
About Us
Company Overview
Leadership
Careers
News & Events
Press Release
Events
Newsletters & App notes
Articles
Contact Us
News & Events
You are here:
XwinSys
> News & Events
Get to know XwinSys upcoming new & events
Press Release
Rigaku Corporation and DYG Holdings LTD Announce Rigaku to Acquire XwinSys Technologies Development Ltd (XWS)
July 15th 2019
Application note
Copper Pillar Bumps Layers Thickness
August 13th 2017
5 seconds Shot for full feature parameters, The Multi-Stack Application for bumps, Accurate and repeatable results
Application note
Onyx Hybrid Metrology - System Automatic Health Monitoring
May 10th 2017
Keep the tool calibrated and stable so that all measurement recipes will yield consistent results over a long period of time.
Events
XwinSys At SEMICON Southeast Asia 2017
March 5th 2017
April 25-27, 2017 SPICE Arena, Penang - Malaysia
Events
XwinSys at SEMICON West 2016
July 14th 2016
SEMICON West 2016 has started.
Press Release
XwinSys Publishes a New Article in Solid State Magazine
July 6th 2016
Unique In-line and non-destructive hybrid technology – a new standard for the semiconductor industry
Press Release
XwinSys will be participating in SEMICON West 2016
June 15th 2016
Patented Hybrid In-Line Metrology System to be Featured
Press Release
XwinSys Receives United States Patent
May 12th 2016
United States Patent Office Grants Process Patent
Press Release
XwinSys Announces Novel Solution for the Semiconductor Industry
February 23rd 2016
NMT: Noise-reduced Multilayer Thin-film Measurement System a Revolutionary Tool
Events
Happy New Year 2016
December 24th 2015
Wonderful Holday Season & Happy New Year
news & events
15/07/2019
Rigaku Corporation and DYG Holdings LTD Announce Rigaku...
13/08/2017
Copper Pillar Bumps Layers Thickness
10/05/2017
Onyx Hybrid Metrology - System Automatic Health Monitoring
05/03/2017
XwinSys At SEMICON Southeast Asia 2017
14/07/2016
XwinSys at SEMICON West 2016
06/07/2016
XwinSys Publishes a New Article in Solid State...
15/06/2016
XwinSys will be participating in SEMICON West 2016
12/05/2016
XwinSys Receives United States Patent
More News & Events by XwinSys
video
Visit our YouTube Channel
Home
Solutions
Film Stack
Ultra-Thin Films Measurement
Light Elements Detection
UBM / RDL: Thickness Monitoring
Bump Inspection - Composition & Height
Real Time Review - Detection & Metrology
Products & Technology
Onyx
Agate
Sapphire
XRF Analysis
3D Scanner
2D Microscope
Support
About Us
Company Overview
Leadership
Careers
News & Events
Press Release
Events
Newsletters & App notes
Articles
Contact Us