Articles

XwinSys has recently launched the ‘ONYX’ - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.

In the semiconductor industry, 3D stacking leads the race to miniaturizing devices at a competitive cost. Thin films are becoming ultra-thin and more localized, and feature wider material variations and smaller scales interactions with less tolerance to aberrations.