XwinSys Solutions

Ultra-Thin Films Measurement

Down to a single Angstrom (Å) based on an enhanced ED-XRF technique.

The semiconductor industry, including nano-devices, is at an inflection point. Two dimensional shrinkages, while still being the holy grail of miniaturization, is giving way to 3D stacking in the race to achieve more condensed volume functionality at an affordable price. This has caused a profusion of changes to system architecture that expresses itself in a wealth of new and complex geometries and materials. Thin films are becoming ultrathin and more localized, and features comprise more materials and material interactions at smaller scales and with increased sensitivity to aberrations.


XwinSys has identified this trend and after investigating the disparities between existing solutions and evolving needs, has developed a novel technology designated as - NMT: Noise-reduced, Multilayer, Thin-film measurement for multipurpose inspection, metrology and analysis of localized ultra-thin layers and features:
  • Helium significantly reduces signal noise
  • Vertical incident X-Ray beam enabling both high flux and small spot size
  • Unique algorithm designed to remove background noise from the elemental signal
Ultra-Thin Films Measurement

Compatible Systems

Onyx
In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.
Agate
Non-destructive inspection and metrology for the semiconductor and micro-electronic industries.