XwinSys Solutions

UBM/RDL: Thickness & Composition Monitoring

Analysis of multi-stack structures and thick mono-layers

Multi-stack structures and thick mono-layers are efficiently analyzed by XRF for layer thickness and composition whereas optical metrology technologies are not capable of simultaneously distinguishing between separate layers, necessitates measuring each layer before application of the next layer.

Other X-Ray techniques such as XRR are not capable of measuring non-planar structures.  
  • Multi stack analysis in one shot
  • CuNiPd / CiNiAu / CuNiZn
  • High TPT performance
  • Multi-element detection is discrete
  • Robust fundamental parameter algorithm for thickness extraction
UBM/RDL: Thickness & Composition Monitoring

Compatible Systems

Onyx
In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.
Agate
Non-destructive inspection and metrology for the semiconductor and micro-electronic industries.