Products & Technologies
Onyx
In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.
Overview
The Onyx dedicated for BEOL applications is a novel fully automated in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.
The unique hybrid configuration of the ONYX enables providing a solution to challenging applications through various analytical approaches and effective SW algorithms:
The ONYX integrates enhanced ED-XRF micro-spot analysis, 3D scanning and 2D microscope technologies, and a unique integrative software to operate in one fully automated system, serving in-line and non-destructive applications. The result of this unique integration is a synergic effect that enables dealing with complex applications in the following manner: Geometrical parameters can be easily monitored with high throughput and precision of the optical components and include features such as: width, length, height, shape and surface. By measuring with the enhanced ED-XRF component, material and volumetric parameters can be obtained, such as film thickness and composition.
The ONYX’s unique triple-mode technologies and capabilities, is designed to meet both fast in-line and in-depth metrology challenges, without interrupting the process flow. Enabling several physical parameters to be measured across the wafer, wafer to wafer, and lot to lot - ensures the process is controlled. The ONYX is dedicated and designed to serve multiple in-line and non-destructive metrology and inspection needs in the semiconductor and related micro-electronics industries.
The unique hybrid configuration of the ONYX enables providing a solution to challenging applications through various analytical approaches and effective SW algorithms:
- Metal film stacks thickness measurements
- Feature dimensions measuring
- Detection and analysis of voids or missing layers
- XRF thickness standards verification
- Detecting specific miss-processing out of a multi-variable metrology application
- Algorithm compensation for parameter variations of a film stack
The ONYX integrates enhanced ED-XRF micro-spot analysis, 3D scanning and 2D microscope technologies, and a unique integrative software to operate in one fully automated system, serving in-line and non-destructive applications. The result of this unique integration is a synergic effect that enables dealing with complex applications in the following manner: Geometrical parameters can be easily monitored with high throughput and precision of the optical components and include features such as: width, length, height, shape and surface. By measuring with the enhanced ED-XRF component, material and volumetric parameters can be obtained, such as film thickness and composition.
The ONYX’s unique triple-mode technologies and capabilities, is designed to meet both fast in-line and in-depth metrology challenges, without interrupting the process flow. Enabling several physical parameters to be measured across the wafer, wafer to wafer, and lot to lot - ensures the process is controlled. The ONYX is dedicated and designed to serve multiple in-line and non-destructive metrology and inspection needs in the semiconductor and related micro-electronics industries.
Technical Specifications
Configuration
XRF
2D Microscope
3D Scanner
| System Parameters | Specifications | Comments |
| Metrology type | Non-destructive ED-XRF and optical techniques | Self-test monitoring system |
| Wafer size | Up to 300mm | |
| X/Y stages resolution | 0.5µm | Feature contour |
| Z stage resolution | 50nm | |
| Back side camera | Easy calibration feature | Auto calibration mode |
| Sample handling | Magazine robot | |
| Automation | Full wafer capability | Single to dual automatic loader |
| Navigation | Precise stages complemented with an image recognition algorithm | Sub-micron fast navigation to single feature center |
| SW user interface | Ease-of-use recipe creation and maintenance | Auto tool health monitoring and auto calibration |
XRF
| XRF beam orientation | Vertical incidence micro-spot XRF | |
| X-ray tube energy | 50KV, 50W | |
| Detector type | Silicon drift detectors (SDD) | Optional: light element detector |
| Detector resolution | 125eV +/- 5eV | With large solid angle |
| X-ray beam spot size (FWHM@8 KeV) | <10μm with poly-capillary optics Small / Regular capillary: Sn - 7μm / 17μm Cu- 10μm / 23μm |
Small spot for high energy elements Variety of spot sizes available |
| Detectable range of elements | All elements down to C(6) | |
| Multi-channel analyzer (MCA) | High efficiency | Larger than1 million photons per second |
2D Microscope
| 2D Microscope | Resolution: 5 Megapixel lateral 0.1 μm Sensor Technology: CCD Color |
Sub-micron navigation with pattern recognition |
| Magnification (optical microscope) | X2, X10 | Option: X20, X50 and other |
3D Scanner
| 3D Scanner | Ultra-fast 3D geometrical parameter extraction i.e. height, shape, structure Vertical resolution: 100 nm |
Insensitive to material absorption |
| Working distance | All materials and any type of sample |
Applications
The unique triple-mode technology offers several film stack critical parameters measurements and quantities
Elemental analysis of low Z elements is performed with a state-of-the-art light elements detector.
Analysis of multi-stack structures and thick mono-layers.
The hybrid solution provides quick and reliable location of bump and wafer defects.
Integrated 3D and 2D metrology and inspection in a single system.
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