Press Release

XwinSys Recent Press Releases

Unique In-line and non-destructive hybrid technology – a new standard for the semiconductor industry
Patented Hybrid In-Line Metrology System to be Featured
United States Patent Office Grants Process Patent
NMT: Noise-reduced Multilayer Thin-film Measurement System a Revolutionary Tool
Significant Progress in Bumps Inspection System for Semiconductor Manufacturing
-Office of the Chief Scientist of Israel Supports Wafer Bumps Inspection and Measurement System-
-Partnership Will Bring New Verification Technology to the Semiconductor Industry-
-New Inspection and Verification Technology for the Semiconductor Industry-