XwinSys Solutions

Film Stack

The unique triple-mode technology offers several film stack critical parameters measurements and quantities

The unique integration of capabilities determines metal film stack composition and thickness along with 3D geometric structural analysis.

Incorporation of enhanced ED-XRF with 3D Scanning and 2D Microscope technologies, offers several film stack critical parameters measurements and quantities: Critical Dimensions (CD), total feature height, upper metals concentrations and individual layer thickness. 

Addressing this kind of challenge, geometrical and atomic data are needed, hence requiring X-Ray and optical technologies outputs - the sophisticated combination using intelligent state-of-the-art analytical software algorithms is capable of isolating the problem and contributing data.

Film stack can be monitored in one shot on a production wafer, while multi-stack monitoring is available for any requirement: first layer thickness, third layer thickness, total feature height, composition, process defect, and more.
Film Stack

Compatible Systems

Onyx
In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.
Agate
Non-destructive inspection and metrology for the semiconductor and micro-electronic industries.