XwinSys Solutions

Bump Inspection - Composition & Height

The hybrid solution provides quick and reliable location of bump and wafer defects

The hybrid solution provides quick and reliable location of bump and wafer defects. The bump, a dome-like structure made of solderable material, is a crucial interconnecting element for connecting chips in a three-dimensional stack and for connecting the stack to the printed circuit board.
  • Elemental composition analysis by optical analysis for geometrical parameters and XRF
  • Vertical incident X-Ray beam (spot down to 7µm on SnK line) using four independent detectors configured in a symmetric assembly
  • Thickness / composition extraction using robust Fundamental Parameters (FP) algorithm
  • Composition analysis using Standardless Fundamental Parameter (SLFP) option
Bump Inspection - Composition & Height

Compatible Systems

Onyx
In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.
Agate
Non-destructive inspection and metrology for the semiconductor and micro-electronic industries.