The hybrid solution provides quick and reliable location of bump and wafer defects. The bump, a dome-like structure made of solderable material, is a crucial interconnecting element for connecting chips in a three-dimensional stack and for connecting the stack to the printed circuit board.
- Elemental composition analysis by optical analysis for geometrical parameters and XRF
- Vertical incident X-Ray beam (spot down to 7µm on SnK line) using four independent detectors configured in a symmetric assembly
- Thickness / composition extraction using robust Fundamental Parameters (FP) algorithm
- Composition analysis using Standardless Fundamental Parameter (SLFP) option