XwinSys has pioneered a hybrid approach to meet complex 3D structures in the semiconductor industry. Combining 3D optics with XRF enables a single measurement to achieve full inspection. Furthermore, the spot size of both analytical techniques is small enough to facilitate monitoring of localized features.
This second core competency covers an optical metrology methodology.
Supplemented with dedicated algorithms and software packages that can be applied to specialized and automated machine-vision solutions, for quality control and hands-free 2D and 3D geometrical measurements in industrial applications.
Computerized image processing is an essential ingredient of this core competence and one that enables accurate and reliable automated inspection.