Products & Technologies

3D Scanner

Covers an optical metrology methodology.

Overview

XwinSys has pioneered a hybrid approach to meet complex 3D structures in the semiconductor industry. Combining 3D optics with XRF enables a single measurement to achieve full inspection. Furthermore, the spot size of both analytical techniques is small enough to facilitate monitoring of localized features.

This second core competency covers an optical metrology methodology.



Supplemented with dedicated algorithms and software packages that can be applied to specialized and automated machine-vision solutions, for quality control and hands-free 2D and 3D geometrical measurements in industrial applications.

Computerized image processing is an essential ingredient of this core competence and one that enables accurate and reliable automated inspection. 
 

Technical Specifications

System Parameters Specifications Comments
3D Scanner Ultra-fast 3D geometrical parameter extraction i.e. height, shape, structure Vertical resolution: 100 nm Insensitive to material absorption
Working distance 150µm / 300µm / 1400µm  

Applications

Film Stack
The unique triple-mode technology offers several film stack critical parameters measurements and quantities
Ultra-Thin Films Measurement
Down to a single Angstrom (Å) based on an enhanced ED-XRF technique.
Light Elements Detection
Elemental analysis of low Z elements is performed with a state-of-the-art light elements detector.
UBM/RDL: Thickness & Composition Monitoring
Analysis of multi-stack structures and thick mono-layers.
Bump Inspection - Composition & Height
The hybrid solution provides quick and reliable location of bump and wafer defects.
Real Time Review - Detection & Metrology
Integrated 3D and 2D metrology and inspection in a single system.