XwinSys has pioneered a hybrid approach to meet complex 3D structures in the semiconductor industry. Combining 3D optics with XRF enables a single measurement to achieve full inspection. Furthermore, the spot size of both analytical techniques is small enough to facilitate monitoring of localized features.
2D Microscope & Image Processing
The main importance of the 2D microscope is its advanced optical features, mainly used for efficient geometrical inspection purposes, as well as an accurate navigation tool. The high level of image processing and pattern recognition allows defect inspection, color inspection, feature dimension, centralization feature, contour extraction and more.