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Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope
Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope
In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution
In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution
Ultra-Thin Film Measurements down to a Single Å Level Based on an Enhanced ED-XRF Technique Ultra-Thin Film Measurements down to a Single Å Level Based on an Enhanced ED-XRF Technique
Ultra-Thin Film Measurements down to a Single Å Level Based on an Enhanced ED-XRF Technique
Detection of Defects & Misprocessing Complemented with In-depth Metrology Detection of Defects & Misprocessing Complemented with In-depth Metrology
Detection of Defects & Misprocessing Complemented with In-depth Metrology
Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection
Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection
Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine,  Sodium and Magnesium Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine,  Sodium and Magnesium
Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine, Sodium and Magnesium

Welcome To XwinSys Technology Development Ltd.

XwinSys is dedicated to the design, manufacture and marketing of novel solutions based on improved X-ray technology combined with automated optical 3D & 2D microscopes, for the Semiconductor and related industries. 

The XwinSys product line was designed to offer an attractive and innovative technological solution to the rapid-growing semiconductors market, allowing multiple application capabilities, modular technological concept, cost-effective maintenance and budget oriented approach.

Integrated and improved X-Ray and optical (3D & 2D) analysis is a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures in the Semiconductor industry.