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Semicon Southeast Asia - Meet us at the Semiconductor Yield  Management Solutions Forum Semicon Southeast Asia - Meet us at the Semiconductor Yield  Management Solutions Forum
Semicon Southeast Asia - Meet us at the Semiconductor Yield Management Solutions Forum
Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope
Hybrid Film Metrology for Packaging: X-Ray Analysis, 3D Scanner & 2D Microscope
In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution
In-Line, Patterned Wafer, Small Spot Metrology & Inspection Solution
Ultra-Thin Film Measurements Down to a Single Å Level Based on an Enhanced ED-XRF Technique Ultra-Thin Film Measurements Down to a Single Å Level Based on an Enhanced ED-XRF Technique
Ultra-Thin Film Measurements Down to a Single Å Level Based on an Enhanced ED-XRF Technique
Detection of Defects & Misprocessing Complemented with In-depth Metrology Detection of Defects & Misprocessing Complemented with In-depth Metrology
Detection of Defects & Misprocessing Complemented with In-depth Metrology
Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection
Real Time Review- Anomalous Color, Shape & Topography Found by XRF, 2D & 3D Inspection
Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine,  Sodium and Magnesium Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine,  Sodium and Magnesium
Light Element XRF Analysis: Carbon, Nitrogen, Oxygen, Fluorine, Sodium and Magnesium

Welcome to XwinSys Technology Development Ltd.

XwinSys is dedicated for the design, manufacturing and marketing of novel metrology solutions for the semiconductor and related industries, based on improved X-Ray technology combined with automated optical 3D scanner & 2D microscope.  
Integrated and improved X-Ray and optical (3D & 2D) analysis is a new approach to meet the semiconductor industry metrology roadmap challenges for both FEOL and BEOL applications, including 3D structures.

The XwinSys product line is designed to offer a solution for the rapid-growing semiconductors market, allowing multiple application capabilities, modular technological concept, cost-effective maintenance and a budget oriented approach.

Integrated and improved X-Ray and optical (3D & 2D) analysis is a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry.